CALABRETTA, Michele

CALABRETTA, Michele  

Dipartimento di Scienze chimiche, biologiche, farmaceutiche e ambientali  

Mostra records
Risultati 1 - 20 di 102 (tempo di esecuzione: 0.022 secondi).
Titolo Data di pubblicazione Autore(i) File
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 1-gen-2011 Sequenzia, G.; Oliveri, S.; Calabretta, M.; Fatuzzo, G.; Cali, M.
A novel integrated approach to optimize copper wire bonding processes and manufacturing 1-gen-2022 Calabretta, M.; Sitta, A.
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 1-gen-2025 Schifano, B.; Sequenzia, G.; Calabretta, M.
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 1-gen-2020 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
An integrated approach to optimize solder joint reliability 1-gen-2020 Sitta, A.; Russo, S.; Torrisi, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Renna, M.; Calabretta, M.
Analisi elettrica, termica e termomeccanica dei meccanismi di invecchiamento di un MOSFET di potenza al carburo di silicio. 1-gen-2025 D'Ambrosio, Moreno; Tripodi, Chiara; Garesci', Francesca; Calabretta, Michele; Patane', Salvatore
Analysis of warpage behavior of electrochemical deposited thick copper on silicon 1-gen-2020 Sitta, A.; Landi, A.; Cafra, B.; Renna, M.; Calabretta, M.
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy 1-gen-2024 Dahrouch, Z.; Malta, G.; D'Ambrosio, M.; Messina, A. A.; Musolino, M.; Sitta, A.; Calabretta, M.; Patane, S.
Attention-Enhanced Convolutional Deep Architecture with Adaptive Jacobian Regularization for Joint Multi-Modal Optical and X-Ray Screening of Silicon-Carbide Power Devices 1-gen-2025 Rundo, F.; Pino, C.; Castagnolo, G.; Messina, A. A.; Calabretta, M.; Battiato, S.
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 1-gen-2025 Donetti, L.; Musolino, M.; Fiore, M.; Mauro, S.; Calabretta, M.; Sequenzia, G.
Characterization and simulation of four bending test to estimate resin-copper adhesion 1-gen-2023 Sitta, A.; Mauromicale, G.; Torrisi, M. A.; Sequenzia, G.; D'Arrigo, G.; Calabretta, M.
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 1-gen-2022 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Copper wire bonding process characterization and simulation 1-gen-2020 Mancaleoni, A.; Sitta, A.; Colombo, A.; Villa, R.; Mirone, G.; Renna, M.; Calabretta, M.
Damping Properties Evaluation of Viscoelastic Lattice Structures 1-gen-2026 Schifano, Biagio; Montemurro, Marco; Sequenzia, Gaetano; Calabretta, Michele
Deep Learning Algorithm for Advanced Level-3 Inverse-Modeling of Silicon-Carbide Power MOSFET Devices 1-gen-2024 Spata, M. O.; Battiato, S.; Ortis, A.; Rundo, F.; Calabretta, M.; Pino, C.; Messina, A.
Deep Learning Approach for the Future Advanced Driver Assistance Systems 1-gen-2025 Sitta, A.; Calabretta, M.; Rundo, F.; Rundo, M.; Spampinato, C.; Sequenzia, G.
Deep Learning Car Driver Motion Magnified Saccadic Eye Movements for Advanced Driving Assistance System 1-gen-2022 Rundo, F.; Messina, A.; Calabretta, M.; Dilonardo, M.; Coffa, S.; Spampinato, C.
Deep Learning for Automatic Wafer Monitoring System 1-gen-2023 Rundo, Francesco; Calabretta, Michele; Pino, Carmelo; Coffa, Salvatore; Messina, Angelo; Spampinato, Concetto; Battiato, Sebastiano