Hybrid Additive Manufacturing for Embedded Electronics: A Process Integration of FFF and Direct Circuit Printing

The integration of structural and functional materials through additive manufacturing opens new perspectives for the development of smart components with embedded electronics. In this study, a novel multi-material and multi-process strategy is proposed to embed conductive circuits directly into 3D-printed PLA substrates. The workflow combines fused filament fabrication (FFF) with direct-write circuit printing. A conductive trace integrated within the PLA structure was fabricated and characterized, showing a resistance of (103.5 ± 0.1) Ω. The process also includes overprinting an additional PLA layer to encapsulate the circuit, enabling the creation of monolithic parts with embedded, protected conductive paths. This technique demonstrates the potential of integrating mechanical and electrical functionalities within a single, additively manufactured part.