Power modules development is becoming more and more important for switching applications, to improve electric and reliability performances. This paper presents an experimental-numerical method to characterize the reliability behavior of ACEPACKTM SMIT package, a top side-cooled module designed with a half bridge topology, which employs high-voltage silicon MOSFETs. The experimental test involves power cycling to study the reliability and thermal behavior. Then, a finite-element based model is developed to simulate test conditions, to calculate temperature behavior inside the package.
Reliability and Thermal Analysis of ACEPACK SMIT Power Module
Calabretta M.;
2023-01-01
Abstract
Power modules development is becoming more and more important for switching applications, to improve electric and reliability performances. This paper presents an experimental-numerical method to characterize the reliability behavior of ACEPACKTM SMIT package, a top side-cooled module designed with a half bridge topology, which employs high-voltage silicon MOSFETs. The experimental test involves power cycling to study the reliability and thermal behavior. Then, a finite-element based model is developed to simulate test conditions, to calculate temperature behavior inside the package.File in questo prodotto:
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