In this work, the thermal characterization of a commercially available SiC-based power module named as ACEPACK Drive, specifically designed by STMicroelectronics for automotive applications, was carried out. In particular, we studied the dynamic thermal behaviour and temperature gradient of one leg of the ACEPACK Drive by a combination of high-speed thermal microscopy and conventional thermal mapping. As main result, the temperature distribution on the device turned out to be homogeneous, with a maximum at around ~99 °C in simulated operative condition.
High speed thermal mapping on six-pack SiC-based module for hybrid and electric vehicles
Malta G.
;Anoldo L.;Mazza B.;Piccione G. G.;Patane S.
2022-01-01
Abstract
In this work, the thermal characterization of a commercially available SiC-based power module named as ACEPACK Drive, specifically designed by STMicroelectronics for automotive applications, was carried out. In particular, we studied the dynamic thermal behaviour and temperature gradient of one leg of the ACEPACK Drive by a combination of high-speed thermal microscopy and conventional thermal mapping. As main result, the temperature distribution on the device turned out to be homogeneous, with a maximum at around ~99 °C in simulated operative condition.File in questo prodotto:
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