IRIS
CALABRETTA, Michele
 Distribuzione geografica
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Continente #
NA - Nord America 751
EU - Europa 518
AS - Asia 517
Continente sconosciuto - Info sul continente non disponibili 112
SA - Sud America 39
AF - Africa 22
Totale 1.959
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Nazione #
US - Stati Uniti d'America 679
RU - Federazione Russa 351
SG - Singapore 245
CN - Cina 137
IT - Italia 99
VN - Vietnam 53
CA - Canada 26
GB - Regno Unito 23
BR - Brasile 19
HK - Hong Kong 17
IN - India 14
AR - Argentina 13
NL - Olanda 13
FR - Francia 11
TT - Trinidad e Tobago 9
BD - Bangladesh 8
CR - Costa Rica 6
GT - Guatemala 6
JM - Giamaica 6
MX - Messico 6
ID - Indonesia 5
IQ - Iraq 5
MY - Malesia 5
ZA - Sudafrica 5
AT - Austria 4
DZ - Algeria 4
JP - Giappone 4
NI - Nicaragua 4
PK - Pakistan 4
SA - Arabia Saudita 4
TR - Turchia 3
VE - Venezuela 3
BA - Bosnia-Erzegovina 2
BB - Barbados 2
EE - Estonia 2
EG - Egitto 2
ES - Italia 2
FI - Finlandia 2
IE - Irlanda 2
MA - Marocco 2
PL - Polonia 2
SV - El Salvador 2
TH - Thailandia 2
TW - Taiwan 2
AE - Emirati Arabi Uniti 1
AL - Albania 1
BF - Burkina Faso 1
BM - Bermuda 1
BS - Bahamas 1
BY - Bielorussia 1
CG - Congo 1
CI - Costa d'Avorio 1
CL - Cile 1
CO - Colombia 1
DE - Germania 1
DK - Danimarca 1
EC - Ecuador 1
IR - Iran 1
KE - Kenya 1
KR - Corea 1
KY - Cayman, isole 1
KZ - Kazakistan 1
LB - Libano 1
LC - Santa Lucia 1
MZ - Mozambico 1
NP - Nepal 1
PH - Filippine 1
PR - Porto Rico 1
PY - Paraguay 1
QA - Qatar 1
SN - Senegal 1
TG - Togo 1
TJ - Tagikistan 1
TN - Tunisia 1
UA - Ucraina 1
UG - Uganda 1
Totale 1.847
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Città #
San Jose 154
Council Bluffs 105
Singapore 59
Moscow 52
Ashburn 40
Hong Kong 17
Beijing 16
Santa Clara 16
Ho Chi Minh City 15
Messina 15
North Bergen 15
Hanoi 11
Los Angeles 10
Milan 9
Palermo 9
Guangzhou 8
Phoenix 8
Dallas 7
New York 7
Brooklyn 6
Chicago 6
Kingston 6
Shanghai 6
Atlanta 5
Delft 5
Orem 5
Columbus 4
Da Nang 4
Guatemala City 4
Managua 4
Port of Spain 4
Rome 4
San José 4
Shenzhen 4
Amsterdam 3
Buffalo 3
Bến Tre 3
Catania 3
Charlotte 3
City of London 3
Denver 3
Haiphong 3
Las Vegas 3
Memphis 3
Miami 3
Queens 3
San Francisco 3
São Paulo 3
Tianjin 3
Toronto 3
Vienna 3
Washington 3
Bangkok 2
Boardman 2
Boise 2
Bridgetown 2
Can Tho 2
Cape Town 2
Corpus Christi 2
Detroit 2
Dublin 2
Edmonton 2
Geneva 2
Gouda 2
Ha'il 2
Hamilton 2
Houston 2
Hải Dương 2
Ispica 2
Jakarta 2
Kuala Lumpur 2
La Brea 2
Lappeenranta 2
Lawrenceville 2
Lodhran 2
London 2
Lyon 2
Mascalucia 2
Mexico City 2
Modena 2
Paris 2
Philadelphia 2
Richmond 2
San Salvador 2
Seattle 2
St. Catharines 2
Thanh Mỹ Tây 2
Thái Bình 2
Tokyo 2
Turin 2
Union City 2
West Covina 2
Abidjan 1
Afragola 1
Akron 1
Albany 1
Aligarh 1
Almaty 1
Alpharetta 1
Alta Gracia 1
Totale 786
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Nome #
Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy 151
Investigation into the Aging Mechanisms of a SiC-Based Power MOSFET by Thermal and Thermomechanical Analysis 62
Analisi elettrica, termica e termomeccanica dei meccanismi di invecchiamento di un MOSFET di potenza al carburo di silicio. 55
Hyperbolic Deep Learning System for Intelligent Gate-Driving and Health Monitoring of Silicon-Carbide Power MOSFETs 46
Dynamic Reverse Bias: Lifetime Modeling for SiC MOSFET Automotive Application 42
Failure Strength Weibull Analysis of 4H-SiC Die through a 3-PB test 40
Long-Term High-Temperature Dynamic Gate Stress Reliability of a Last-Generation, Automotive-Grade, Planar 1200 V SiC MOSFET 38
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 38
Deep Learning for Automatic Wafer Monitoring System 38
The reliability challenge of SiC Power Modules in Automotive Applications 36
Attention-Enhanced Convolutional Deep Architecture with Adaptive Jacobian Regularization for Joint Multi-Modal Optical and X-Ray Screening of Silicon-Carbide Power Devices 30
Deep Learning Car Driver Motion Magnified Saccadic Eye Movements for Advanced Driving Assistance System 29
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 29
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 29
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 29
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 29
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 28
Copper wire bonding process characterization and simulation 28
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 27
An integrated approach to optimize solder joint reliability 27
Characterization and simulation of four bending test to estimate resin-copper adhesion 27
Deep Learning for Risk Assessment in Automotive Applications 26
A novel integrated approach to optimize copper wire bonding processes and manufacturing 25
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 25
Deep Learning Algorithm for Advanced Level-3 Inverse-Modeling of Silicon-Carbide Power MOSFET Devices 24
Deep Learning Approach for the Future Advanced Driver Assistance Systems 24
Development of a Timing Chain Drive Model for a High Speed Gasoline Engine 22
Valvetrain friction - modeling, analysis and measurement of a high performance engine valvetrain system 21
System and method for voltage drift monitoring 19
Jacobian regularized power electronic device monitoring 19
Warpage modeling for semiconductor power module manufacturing flow improvement 19
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 19
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 19
System and method for power module defect detection 18
Thermal transient testing alternatives for the characterisation of GaN HEMT power devices 17
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction 17
Analysis of warpage behavior of electrochemical deposited thick copper on silicon 17
Reliability assessment of SiC power MOSFETs in dynamic reverse bias test 17
Mechanical characterization and properties of continuous wave laser irradiated Ge2Sb2Te5 stripes 16
Implementation and Comparison of SiC and GaN switches for EV Fast Recharging Systems 16
SPICE Modelling of commercially availabe 1200V, 30mΩ MOSFET at different Temperatures for Static Characteristics 16
Process for manufacturing a strained semiconductor device and corresponding strained semiconductor device 16
Optimization of pin-fin arrangement in traction inverter cooling systems: A framework based on CFD simulations, deep neural networks and evolutionary algorithms 16
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge2Sb2Te5 layers 16
Modeling of variable valve timing on high performance engine using power-oriented graphs method 15
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 15
Lifetime Modeling for Silicon Carbide Based Power Module 15
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop 15
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 15
Experimental Reliability Assessment of ACEPACK SMIT Power Module 14
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 14
Solder joint reliability: Thermo-mechanical analysis on power flat packages 14
Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test 14
Development of n-type epitaxial growth on 200 mm 4H-SiC wafers for the next generation of power devices 14
Method for the manufacture of integrated devices including a die fixed to a leadframe 14
Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: A Parametric Study 14
Performances Evaluation of Electric Vehicles Recharging Systems Implementing Silicon Carbide and Gallium Nitride Switches 13
Mechanical Characterization of Power Electronics Solder Materials 13
Intelligent Deep Motion Magnification Analysis in Advanced Driving Assistance Systems 13
TIMs for transfer molded power modules: Characterization, reliability, and modeling 12
Power Module Ceramic Substrates: Mechanical characterization and modeling 12
Experimental characterization and modeling of power module warpage during assembly process 12
Electrical Wafer Sorting: a Deep Learning Approach for Advanced Wafer Defect Map Evaluation 12
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 12
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 12
Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field 12
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 12
Silicon carbide die sintering layer: manufacturing process optimization and modeling 12
NURBS-Based Surrogate Model for Fast and High-Fidelity Predictions of Pressure Drop and Pin-Fins Temperature in Traction Inverter 12
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 12
Identification of Interface States responsible for VTHHysteresis in packaged SiC MOSFETs 12
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 12
Damping Properties Evaluation of Viscoelastic Lattice Structures 12
Intelligent Optical Microscopy Defects Assessment of Silicon-Carbide Power Modules embedded in Next Generation Electric Cars 12
Nonlinear Robust Control of a Quadratic Boost Converter in a Wide Operation Range, Based on Extended Linearization Method 11
Power losses comparison between Silicon Carbide and Silicon devices for an isolated DC-DC converter 11
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive 11
Effects of Hydrogen Bonding in Silicon Nitride/Polyimide Passivation Bilayer in SiC Power Devices 11
The "first and euRopEAn siC eighT Inches pilOt liNe": A project, called REACTION, that will boost key SiC Technologies upgrading (developments) in Europe, unleashing Applications in the Automotive Power Electronics Sector 11
Numerical approach to predict power device reliability 11
Electrical characterization of gate oxide current in a silicon power MOS subjected to uniaxial mechanical stress 11
Power Packages Interconnections for High Reliability Automotive Applications 10
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 10
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 10
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 10
Dynamic Reverse Bias Test: Electro-Thermal Characterization of SiC MOSFETs 10
Structural characterization of semiconductor multi-layer pad 10
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 10
Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications 10
Thermal analysis approach for predicting power device lifetime 10
Hybrid Deep Learning Pipeline for Advanced Electrical Wafer Defect Maps Assessment 9
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 9
Paving the way toward the world's first 200mm SiC pilot line 9
Fast transient thermomechanical stress to set a pressure-assisted sintering process 9
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 8
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules 8
Experimental evaluation of oxide current on a low voltage trench gate power mos under mechanical bending conditions 8
Thermal measurement and numerical analysis for automotive power modules 8
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 8
Dynamic Gate Stress: Impact of duty cycle and gate resistance on automotive grade planar-gate 1200 V SiC MOSFET 8
Totale 1.945
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Categoria #
all - tutte 7.044
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 7.044
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2023/20249 0 0 0 0 0 0 0 0 0 0 0 9
2024/202532 1 0 2 2 7 1 1 9 5 1 1 2
2025/20261.224 6 4 4 8 50 91 177 313 178 244 127 22
2026/2027694 51 221 109 294 19 0 0 0 0 0 0 0
Totale 1.959