IRIS
CALABRETTA, Michele
 Distribuzione geografica
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Continente #
AS - Asia 458
EU - Europa 438
NA - Nord America 200
SA - Sud America 33
AF - Africa 22
Totale 1.151
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Nazione #
RU - Federazione Russa 351
SG - Singapore 234
US - Stati Uniti d'America 181
CN - Cina 112
VN - Vietnam 53
IT - Italia 49
BR - Brasile 15
HK - Hong Kong 14
AR - Argentina 13
IN - India 12
FR - Francia 8
BD - Bangladesh 7
CA - Canada 7
NL - Olanda 7
GB - Regno Unito 6
IQ - Iraq 5
MX - Messico 5
ZA - Sudafrica 5
AT - Austria 4
DZ - Algeria 4
SA - Arabia Saudita 4
ID - Indonesia 3
TR - Turchia 3
VE - Venezuela 3
BA - Bosnia-Erzegovina 2
EG - Egitto 2
ES - Italia 2
FI - Finlandia 2
IE - Irlanda 2
JM - Giamaica 2
JP - Giappone 2
MA - Marocco 2
MY - Malesia 2
NI - Nicaragua 2
PL - Polonia 2
AL - Albania 1
BB - Barbados 1
BF - Burkina Faso 1
BY - Bielorussia 1
CG - Congo 1
CI - Costa d'Avorio 1
CL - Cile 1
GT - Guatemala 1
KE - Kenya 1
KZ - Kazakistan 1
LB - Libano 1
MZ - Mozambico 1
NP - Nepal 1
PH - Filippine 1
PK - Pakistan 1
PY - Paraguay 1
SN - Senegal 1
SV - El Salvador 1
TG - Togo 1
TJ - Tagikistan 1
TN - Tunisia 1
TW - Taiwan 1
UA - Ucraina 1
UG - Uganda 1
Totale 1.151
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Città #
San Jose 99
Moscow 52
Singapore 52
Ashburn 23
Ho Chi Minh City 15
Hong Kong 14
Beijing 12
Messina 12
Hanoi 11
Palermo 9
Guangzhou 8
Santa Clara 6
Orem 5
Da Nang 4
Dallas 4
Delft 4
Los Angeles 4
Milan 4
Shenzhen 4
Amsterdam 3
Bến Tre 3
Haiphong 3
São Paulo 3
Vienna 3
Brooklyn 2
Can Tho 2
Cape Town 2
Catania 2
Chicago 2
Dublin 2
Ha'il 2
Hải Dương 2
Ispica 2
Kingston 2
Lappeenranta 2
London 2
Lyon 2
Managua 2
Mascalucia 2
Memphis 2
Miami 2
New York 2
Paris 2
Thanh Mỹ Tây 2
Thái Bình 2
Tianjin 2
Abidjan 1
Aligarh 1
Almaty 1
Alta Gracia 1
Antalya 1
Asunción 1
Austin 1
Azcapotzalco 1
Ba Dinh 1
Badlapur 1
Baghdad 1
Bakersfield 1
Banda Aceh 1
Bejaâd 1
Belo Horizonte 1
Bhopal 1
Bihać 1
Biên Hòa 1
Blackpool 1
Blida 1
Bois-Colombes 1
Brampton 1
Brazzaville 1
Brest 1
Bridgetown 1
Buffalo 1
Butuan 1
Bắc Giang 1
Cabo Frio 1
Canela 1
Caracas 1
Casilda 1
Caxias do Sul 1
Chartres 1
Cherkasy 1
Chiari 1
Chittagong 1
Comodoro Rivadavia 1
Constantine 1
Coro 1
Council Bluffs 1
Curitiba 1
Córdoba 1
Dakar 1
Dartmouth 1
Denver 1
Detroit 1
Dhaka 1
Dushanbe 1
Ecatepec 1
Edison 1
Erbil 1
Faridabad 1
Forest City 1
Totale 455
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Nome #
Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy 134
Investigation into the Aging Mechanisms of a SiC-Based Power MOSFET by Thermal and Thermomechanical Analysis 51
Hyperbolic Deep Learning System for Intelligent Gate-Driving and Health Monitoring of Silicon-Carbide Power MOSFETs 38
Analisi elettrica, termica e termomeccanica dei meccanismi di invecchiamento di un MOSFET di potenza al carburo di silicio. 37
Deep Learning for Automatic Wafer Monitoring System 34
Dynamic Reverse Bias: Lifetime Modeling for SiC MOSFET Automotive Application 33
The reliability challenge of SiC Power Modules in Automotive Applications 32
Failure Strength Weibull Analysis of 4H-SiC Die through a 3-PB test 29
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 29
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 23
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 23
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 22
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 22
Attention-Enhanced Convolutional Deep Architecture with Adaptive Jacobian Regularization for Joint Multi-Modal Optical and X-Ray Screening of Silicon-Carbide Power Devices 22
Copper wire bonding process characterization and simulation 22
A novel integrated approach to optimize copper wire bonding processes and manufacturing 21
Characterization and simulation of four bending test to estimate resin-copper adhesion 21
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 20
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 20
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 20
An integrated approach to optimize solder joint reliability 19
Deep Learning Algorithm for Advanced Level-3 Inverse-Modeling of Silicon-Carbide Power MOSFET Devices 18
Deep Learning Car Driver Motion Magnified Saccadic Eye Movements for Advanced Driving Assistance System 17
Deep Learning for Risk Assessment in Automotive Applications 17
Deep Learning Approach for the Future Advanced Driver Assistance Systems 16
Analysis of warpage behavior of electrochemical deposited thick copper on silicon 15
Valvetrain friction - modeling, analysis and measurement of a high performance engine valvetrain system 14
Jacobian regularized power electronic device monitoring 14
Development of a Timing Chain Drive Model for a High Speed Gasoline Engine 14
Modeling of variable valve timing on high performance engine using power-oriented graphs method 13
Lifetime Modeling for Silicon Carbide Based Power Module 13
System and method for voltage drift monitoring 12
System and method for power module defect detection 11
Solder joint reliability: Thermo-mechanical analysis on power flat packages 11
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 11
Warpage modeling for semiconductor power module manufacturing flow improvement 10
Method for the manufacture of integrated devices including a die fixed to a leadframe 10
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 10
Experimental characterization and modeling of power module warpage during assembly process 9
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop 9
Process for manufacturing a strained semiconductor device and corresponding strained semiconductor device 9
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction 9
Silicon carbide die sintering layer: manufacturing process optimization and modeling 8
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 8
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 8
Experimental Reliability Assessment of ACEPACK SMIT Power Module 7
Long-Term High-Temperature Dynamic Gate Stress Reliability of a Last-Generation, Automotive-Grade, Planar 1200 V SiC MOSFET 7
Mechanical characterization and properties of continuous wave laser irradiated Ge2Sb2Te5 stripes 7
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive 7
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 7
Optimization of pin-fin arrangement in traction inverter cooling systems: A framework based on CFD simulations, deep neural networks and evolutionary algorithms 7
Mechanical Characterization of Power Electronics Solder Materials 7
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge2Sb2Te5 layers 7
Development of n-type epitaxial growth on 200 mm 4H-SiC wafers for the next generation of power devices 7
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 7
Reliability assessment of SiC power MOSFETs in dynamic reverse bias test 7
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 6
Performances Evaluation of Electric Vehicles Recharging Systems Implementing Silicon Carbide and Gallium Nitride Switches 6
SPICE Modelling of commercially availabe 1200V, 30mΩ MOSFET at different Temperatures for Static Characteristics 6
Effects of Hydrogen Bonding in Silicon Nitride/Polyimide Passivation Bilayer in SiC Power Devices 6
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 6
Dynamic Reverse Bias Test: Electro-Thermal Characterization of SiC MOSFETs 6
Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test 6
Structural characterization of semiconductor multi-layer pad 6
Numerical approach to predict power device reliability 6
Thermal measurement and numerical analysis for automotive power modules 6
Paving the way toward the world's first 200mm SiC pilot line 6
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 6
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 6
Thermal analysis approach for predicting power device lifetime 6
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 5
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules 5
TIMs for transfer molded power modules: Characterization, reliability, and modeling 5
Experimental evaluation of oxide current on a low voltage trench gate power mos under mechanical bending conditions 5
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 5
Nonlinear Robust Control of a Quadratic Boost Converter in a Wide Operation Range, Based on Extended Linearization Method 5
Power Packages Interconnections for High Reliability Automotive Applications 5
Power Module Ceramic Substrates: Mechanical characterization and modeling 5
Implementation and Comparison of SiC and GaN switches for EV Fast Recharging Systems 5
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 5
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 5
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 5
Hybrid Deep Learning Pipeline for Advanced Electrical Wafer Defect Maps Assessment 5
Thermal transient testing alternatives for the characterisation of GaN HEMT power devices 5
Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field 5
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 5
The "first and euRopEAn siC eighT Inches pilOt liNe": A project, called REACTION, that will boost key SiC Technologies upgrading (developments) in Europe, unleashing Applications in the Automotive Power Electronics Sector 5
Intelligent Deep Motion Magnification Analysis in Advanced Driving Assistance Systems 5
Electrical characterization of gate oxide current in a silicon power MOS subjected to uniaxial mechanical stress 5
Identification of Interface States responsible for VTHHysteresis in packaged SiC MOSFETs 5
Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications 5
Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: A Parametric Study 5
Mechanical characterization and modeling of different pad structures 5
Fast transient thermomechanical stress to set a pressure-assisted sintering process 5
Intelligent Optical Microscopy Defects Assessment of Silicon-Carbide Power Modules embedded in Next Generation Electric Cars 5
Power losses comparison between Silicon Carbide and Silicon devices for an isolated DC-DC converter 4
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications 4
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 3
Electrical Wafer Sorting: a Deep Learning Approach for Advanced Wafer Defect Map Evaluation 2
NURBS-Based Surrogate Model for Fast and High-Fidelity Predictions of Pressure Drop and Pin-Fins Temperature in Traction Inverter 2
Totale 1.259
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Categoria #
all - tutte 3.888
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 3.888
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2023/20249 0 0 0 0 0 0 0 0 0 0 0 9
2024/202532 1 0 2 2 7 1 1 9 5 1 1 2
2025/20261.222 6 4 4 8 50 91 177 313 178 244 127 20
Totale 1.263