IRIS
CALABRETTA, Michele
 Distribuzione geografica
Salva come PNG Salva come JPEG
Continente #
AS - Asia 446
EU - Europa 420
NA - Nord America 69
SA - Sud America 32
AF - Africa 22
Totale 989
Salva come PNG Salva come JPEG
Nazione #
RU - Federazione Russa 351
SG - Singapore 231
CN - Cina 105
US - Stati Uniti d'America 54
VN - Vietnam 52
IT - Italia 39
BR - Brasile 14
HK - Hong Kong 14
AR - Argentina 13
IN - India 12
BD - Bangladesh 7
CA - Canada 6
FR - Francia 5
IQ - Iraq 5
MX - Messico 5
NL - Olanda 5
ZA - Sudafrica 5
AT - Austria 4
DZ - Algeria 4
GB - Regno Unito 4
SA - Arabia Saudita 4
ID - Indonesia 3
TR - Turchia 3
VE - Venezuela 3
BA - Bosnia-Erzegovina 2
EG - Egitto 2
FI - Finlandia 2
IE - Irlanda 2
JM - Giamaica 2
MA - Marocco 2
MY - Malesia 2
PL - Polonia 2
AL - Albania 1
BF - Burkina Faso 1
BY - Bielorussia 1
CG - Congo 1
CI - Costa d'Avorio 1
CL - Cile 1
ES - Italia 1
JP - Giappone 1
KE - Kenya 1
KZ - Kazakistan 1
LB - Libano 1
MZ - Mozambico 1
NI - Nicaragua 1
NP - Nepal 1
PH - Filippine 1
PK - Pakistan 1
PY - Paraguay 1
SN - Senegal 1
SV - El Salvador 1
TG - Togo 1
TJ - Tagikistan 1
TN - Tunisia 1
TW - Taiwan 1
UA - Ucraina 1
UG - Uganda 1
Totale 989
Salva come PNG Salva come JPEG
Città #
Moscow 52
Singapore 51
Ashburn 18
Ho Chi Minh City 15
Hong Kong 14
Beijing 10
Hanoi 10
Palermo 9
Guangzhou 8
Messina 8
San Jose 7
Da Nang 4
Milan 4
Orem 4
Shenzhen 4
Amsterdam 3
Bến Tre 3
Haiphong 3
São Paulo 3
Vienna 3
Brooklyn 2
Can Tho 2
Cape Town 2
Catania 2
Dallas 2
Delft 2
Dublin 2
Ha'il 2
Hải Dương 2
Ispica 2
Kingston 2
Lappeenranta 2
London 2
Los Angeles 2
Lyon 2
Mascalucia 2
New York 2
Santa Clara 2
Thanh Mỹ Tây 2
Thái Bình 2
Tianjin 2
Abidjan 1
Aligarh 1
Almaty 1
Alta Gracia 1
Antalya 1
Asunción 1
Azcapotzalco 1
Ba Dinh 1
Badlapur 1
Baghdad 1
Bakersfield 1
Banda Aceh 1
Bejaâd 1
Belo Horizonte 1
Bhopal 1
Bihać 1
Biên Hòa 1
Blackpool 1
Blida 1
Brazzaville 1
Brest 1
Butuan 1
Bắc Giang 1
Cabo Frio 1
Canela 1
Caracas 1
Casilda 1
Caxias do Sul 1
Chartres 1
Cherkasy 1
Chicago 1
Chittagong 1
Comodoro Rivadavia 1
Constantine 1
Coro 1
Curitiba 1
Córdoba 1
Dakar 1
Dartmouth 1
Denver 1
Detroit 1
Dhaka 1
Dushanbe 1
Ecatepec 1
Edison 1
Erbil 1
Faridabad 1
Forest City 1
Formiga 1
Franco da Rocha 1
General Rodríguez 1
Giza 1
Go Vap 1
Ha Long 1
Hampton 1
Hortolândia 1
Ipiranga do Norte 1
Ismailia 1
Jakarta 1
Totale 334
Salva come PNG Salva come JPEG
Nome #
Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy 131
Investigation into the Aging Mechanisms of a SiC-Based Power MOSFET by Thermal and Thermomechanical Analysis 50
Hyperbolic Deep Learning System for Intelligent Gate-Driving and Health Monitoring of Silicon-Carbide Power MOSFETs 35
Analisi elettrica, termica e termomeccanica dei meccanismi di invecchiamento di un MOSFET di potenza al carburo di silicio. 35
Deep Learning for Automatic Wafer Monitoring System 34
Dynamic Reverse Bias: Lifetime Modeling for SiC MOSFET Automotive Application 30
Failure Strength Weibull Analysis of 4H-SiC Die through a 3-PB test 28
The reliability challenge of SiC Power Modules in Automotive Applications 28
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 23
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 22
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 22
Characterization and simulation of four bending test to estimate resin-copper adhesion 21
Copper wire bonding process characterization and simulation 20
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 19
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 19
Attention-Enhanced Convolutional Deep Architecture with Adaptive Jacobian Regularization for Joint Multi-Modal Optical and X-Ray Screening of Silicon-Carbide Power Devices 19
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 19
An integrated approach to optimize solder joint reliability 19
A novel integrated approach to optimize copper wire bonding processes and manufacturing 18
Deep Learning Algorithm for Advanced Level-3 Inverse-Modeling of Silicon-Carbide Power MOSFET Devices 18
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 18
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 17
Deep Learning for Risk Assessment in Automotive Applications 16
Deep Learning Approach for the Future Advanced Driver Assistance Systems 16
Deep Learning Car Driver Motion Magnified Saccadic Eye Movements for Advanced Driving Assistance System 15
Analysis of warpage behavior of electrochemical deposited thick copper on silicon 15
Jacobian regularized power electronic device monitoring 13
Modeling of variable valve timing on high performance engine using power-oriented graphs method 12
Lifetime Modeling for Silicon Carbide Based Power Module 12
Valvetrain friction - modeling, analysis and measurement of a high performance engine valvetrain system 12
Development of a Timing Chain Drive Model for a High Speed Gasoline Engine 12
System and method for voltage drift monitoring 10
System and method for power module defect detection 10
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 9
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop 8
Process for manufacturing a strained semiconductor device and corresponding strained semiconductor device 8
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction 8
Experimental characterization and modeling of power module warpage during assembly process 7
Method for the manufacture of integrated devices including a die fixed to a leadframe 7
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 7
Experimental Reliability Assessment of ACEPACK SMIT Power Module 6
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive 6
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 6
Optimization of pin-fin arrangement in traction inverter cooling systems: A framework based on CFD simulations, deep neural networks and evolutionary algorithms 6
Mechanical Characterization of Power Electronics Solder Materials 6
Solder joint reliability: Thermo-mechanical analysis on power flat packages 6
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 6
Long-Term High-Temperature Dynamic Gate Stress Reliability of a Last-Generation, Automotive-Grade, Planar 1200 V SiC MOSFET 5
Mechanical characterization and properties of continuous wave laser irradiated Ge2Sb2Te5 stripes 5
Performances Evaluation of Electric Vehicles Recharging Systems Implementing Silicon Carbide and Gallium Nitride Switches 5
Effects of Hydrogen Bonding in Silicon Nitride/Polyimide Passivation Bilayer in SiC Power Devices 5
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge2Sb2Te5 layers 5
Silicon carbide die sintering layer: manufacturing process optimization and modeling 5
Numerical approach to predict power device reliability 5
Thermal measurement and numerical analysis for automotive power modules 5
Development of n-type epitaxial growth on 200 mm 4H-SiC wafers for the next generation of power devices 5
Paving the way toward the world's first 200mm SiC pilot line 5
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 5
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 5
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 5
Thermal analysis approach for predicting power device lifetime 5
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 5
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 4
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules 4
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 4
TIMs for transfer molded power modules: Characterization, reliability, and modeling 4
Experimental evaluation of oxide current on a low voltage trench gate power mos under mechanical bending conditions 4
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 4
Nonlinear Robust Control of a Quadratic Boost Converter in a Wide Operation Range, Based on Extended Linearization Method 4
Power Packages Interconnections for High Reliability Automotive Applications 4
Power Module Ceramic Substrates: Mechanical characterization and modeling 4
Implementation and Comparison of SiC and GaN switches for EV Fast Recharging Systems 4
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 4
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 4
Warpage modeling for semiconductor power module manufacturing flow improvement 4
SPICE Modelling of commercially availabe 1200V, 30mΩ MOSFET at different Temperatures for Static Characteristics 4
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 4
Hybrid Deep Learning Pipeline for Advanced Electrical Wafer Defect Maps Assessment 4
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 4
Thermal transient testing alternatives for the characterisation of GaN HEMT power devices 4
Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field 4
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 4
The "first and euRopEAn siC eighT Inches pilOt liNe": A project, called REACTION, that will boost key SiC Technologies upgrading (developments) in Europe, unleashing Applications in the Automotive Power Electronics Sector 4
Dynamic Reverse Bias Test: Electro-Thermal Characterization of SiC MOSFETs 4
Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test 4
Intelligent Deep Motion Magnification Analysis in Advanced Driving Assistance Systems 4
Electrical characterization of gate oxide current in a silicon power MOS subjected to uniaxial mechanical stress 4
Identification of Interface States responsible for VTHHysteresis in packaged SiC MOSFETs 4
Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications 4
Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: A Parametric Study 4
Reliability assessment of SiC power MOSFETs in dynamic reverse bias test 4
Mechanical characterization and modeling of different pad structures 4
Fast transient thermomechanical stress to set a pressure-assisted sintering process 4
Intelligent Optical Microscopy Defects Assessment of Silicon-Carbide Power Modules embedded in Next Generation Electric Cars 4
Power losses comparison between Silicon Carbide and Silicon devices for an isolated DC-DC converter 3
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications 3
Structural characterization of semiconductor multi-layer pad 3
Electrical Wafer Sorting: a Deep Learning Approach for Advanced Wafer Defect Map Evaluation 1
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 1
NURBS-Based Surrogate Model for Fast and High-Fidelity Predictions of Pressure Drop and Pin-Fins Temperature in Traction Inverter 1
Totale 1.099
Salva come PNG Salva come JPEG
Categoria #
all - tutte 2.161
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 2.161
Salva come PNG Salva come JPEG


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2023/20249 0 0 0 0 0 0 0 0 0 0 0 9
2024/202532 1 0 2 2 7 1 1 9 5 1 1 2
2025/20261.060 6 4 4 8 50 91 177 313 178 229 0 0
Totale 1.101