IRIS
CALABRETTA, Michele
 Distribuzione geografica
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Continente #
AS - Asia 494
EU - Europa 455
NA - Nord America 392
Continente sconosciuto - Info sul continente non disponibili 112
SA - Sud America 35
AF - Africa 22
Totale 1.510
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Nazione #
US - Stati Uniti d'America 356
RU - Federazione Russa 351
SG - Singapore 241
CN - Cina 131
IT - Italia 61
VN - Vietnam 53
BR - Brasile 16
HK - Hong Kong 16
AR - Argentina 13
IN - India 12
CA - Canada 10
GB - Regno Unito 9
NL - Olanda 9
BD - Bangladesh 8
FR - Francia 8
MX - Messico 6
ID - Indonesia 5
IQ - Iraq 5
MY - Malesia 5
ZA - Sudafrica 5
AT - Austria 4
CR - Costa Rica 4
DZ - Algeria 4
SA - Arabia Saudita 4
TT - Trinidad e Tobago 4
GT - Guatemala 3
JM - Giamaica 3
JP - Giappone 3
NI - Nicaragua 3
TR - Turchia 3
VE - Venezuela 3
BA - Bosnia-Erzegovina 2
EG - Egitto 2
ES - Italia 2
FI - Finlandia 2
IE - Irlanda 2
MA - Marocco 2
PL - Polonia 2
AE - Emirati Arabi Uniti 1
AL - Albania 1
BB - Barbados 1
BF - Burkina Faso 1
BM - Bermuda 1
BY - Bielorussia 1
CG - Congo 1
CI - Costa d'Avorio 1
CL - Cile 1
EC - Ecuador 1
KE - Kenya 1
KZ - Kazakistan 1
LB - Libano 1
MZ - Mozambico 1
NP - Nepal 1
PH - Filippine 1
PK - Pakistan 1
PY - Paraguay 1
SN - Senegal 1
SV - El Salvador 1
TG - Togo 1
TJ - Tagikistan 1
TN - Tunisia 1
TW - Taiwan 1
UA - Ucraina 1
UG - Uganda 1
Totale 1.398
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Città #
San Jose 148
Council Bluffs 90
Singapore 56
Moscow 52
Ashburn 27
Beijing 16
Hong Kong 16
Ho Chi Minh City 15
Messina 12
Santa Clara 12
Hanoi 11
Palermo 9
Guangzhou 8
Dallas 5
Orem 5
Da Nang 4
Delft 4
Los Angeles 4
Milan 4
Shanghai 4
Shenzhen 4
Amsterdam 3
Bến Tre 3
City of London 3
Guatemala City 3
Haiphong 3
Kingston 3
Managua 3
Memphis 3
San José 3
São Paulo 3
Tianjin 3
Vienna 3
Brooklyn 2
Buffalo 2
Can Tho 2
Cape Town 2
Catania 2
Chicago 2
Dublin 2
Ha'il 2
Hải Dương 2
Ispica 2
Jakarta 2
Kuala Lumpur 2
La Brea 2
Lappeenranta 2
London 2
Lyon 2
Mascalucia 2
Mexico City 2
Miami 2
New York 2
Paris 2
Phoenix 2
Port of Spain 2
Richmond 2
Thanh Mỹ Tây 2
Thái Bình 2
Abidjan 1
Aligarh 1
Almaty 1
Alta Gracia 1
Antalya 1
Asunción 1
Atlanta 1
Austin 1
Azcapotzalco 1
Ba Dinh 1
Badlapur 1
Baghdad 1
Bakersfield 1
Banda Aceh 1
Bejaâd 1
Belo Horizonte 1
Bhopal 1
Bihać 1
Biên Hòa 1
Blackpool 1
Blida 1
Bois-Colombes 1
Boise 1
Brampton 1
Brantford 1
Brazzaville 1
Brest 1
Bridgetown 1
Butuan 1
Bắc Giang 1
Cabo Frio 1
Cambridge 1
Cambridge-Narrows 1
Canela 1
Caracas 1
Casilda 1
Caxias do Sul 1
Chartres 1
Cherkasy 1
Chiari 1
Chittagong 1
Totale 635
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Nome #
Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy 135
Investigation into the Aging Mechanisms of a SiC-Based Power MOSFET by Thermal and Thermomechanical Analysis 55
Hyperbolic Deep Learning System for Intelligent Gate-Driving and Health Monitoring of Silicon-Carbide Power MOSFETs 41
Analisi elettrica, termica e termomeccanica dei meccanismi di invecchiamento di un MOSFET di potenza al carburo di silicio. 41
Dynamic Reverse Bias: Lifetime Modeling for SiC MOSFET Automotive Application 37
Deep Learning for Automatic Wafer Monitoring System 36
The reliability challenge of SiC Power Modules in Automotive Applications 34
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 33
Failure Strength Weibull Analysis of 4H-SiC Die through a 3-PB test 31
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 28
Attention-Enhanced Convolutional Deep Architecture with Adaptive Jacobian Regularization for Joint Multi-Modal Optical and X-Ray Screening of Silicon-Carbide Power Devices 26
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 26
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 25
Copper wire bonding process characterization and simulation 25
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 24
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 24
An integrated approach to optimize solder joint reliability 24
Deep Learning Car Driver Motion Magnified Saccadic Eye Movements for Advanced Driving Assistance System 23
Characterization and simulation of four bending test to estimate resin-copper adhesion 23
A novel integrated approach to optimize copper wire bonding processes and manufacturing 22
Deep Learning Algorithm for Advanced Level-3 Inverse-Modeling of Silicon-Carbide Power MOSFET Devices 22
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 22
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 21
Deep Learning for Risk Assessment in Automotive Applications 21
Jacobian regularized power electronic device monitoring 18
Valvetrain friction - modeling, analysis and measurement of a high performance engine valvetrain system 17
Development of a Timing Chain Drive Model for a High Speed Gasoline Engine 17
Deep Learning Approach for the Future Advanced Driver Assistance Systems 17
System and method for power module defect detection 16
Analysis of warpage behavior of electrochemical deposited thick copper on silicon 16
System and method for voltage drift monitoring 15
Warpage modeling for semiconductor power module manufacturing flow improvement 15
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 15
Modeling of variable valve timing on high performance engine using power-oriented graphs method 14
Lifetime Modeling for Silicon Carbide Based Power Module 14
Process for manufacturing a strained semiconductor device and corresponding strained semiconductor device 14
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction 13
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 13
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop 12
Method for the manufacture of integrated devices including a die fixed to a leadframe 12
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 11
Long-Term High-Temperature Dynamic Gate Stress Reliability of a Last-Generation, Automotive-Grade, Planar 1200 V SiC MOSFET 11
Implementation and Comparison of SiC and GaN switches for EV Fast Recharging Systems 11
Silicon carbide die sintering layer: manufacturing process optimization and modeling 11
Solder joint reliability: Thermo-mechanical analysis on power flat packages 11
Mechanical characterization and properties of continuous wave laser irradiated Ge2Sb2Te5 stripes 10
Experimental characterization and modeling of power module warpage during assembly process 10
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 10
Optimization of pin-fin arrangement in traction inverter cooling systems: A framework based on CFD simulations, deep neural networks and evolutionary algorithms 10
Development of n-type epitaxial growth on 200 mm 4H-SiC wafers for the next generation of power devices 10
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 10
Experimental Reliability Assessment of ACEPACK SMIT Power Module 9
Nonlinear Robust Control of a Quadratic Boost Converter in a Wide Operation Range, Based on Extended Linearization Method 9
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive 9
SPICE Modelling of commercially availabe 1200V, 30mΩ MOSFET at different Temperatures for Static Characteristics 9
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge2Sb2Te5 layers 9
Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: A Parametric Study 9
Reliability assessment of SiC power MOSFETs in dynamic reverse bias test 9
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 9
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 8
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 8
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 8
Mechanical Characterization of Power Electronics Solder Materials 8
Dynamic Reverse Bias Test: Electro-Thermal Characterization of SiC MOSFETs 8
Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test 8
Numerical approach to predict power device reliability 8
Paving the way toward the world's first 200mm SiC pilot line 8
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 8
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 8
Fast transient thermomechanical stress to set a pressure-assisted sintering process 8
Experimental evaluation of oxide current on a low voltage trench gate power mos under mechanical bending conditions 7
Power Module Ceramic Substrates: Mechanical characterization and modeling 7
Performances Evaluation of Electric Vehicles Recharging Systems Implementing Silicon Carbide and Gallium Nitride Switches 7
Effects of Hydrogen Bonding in Silicon Nitride/Polyimide Passivation Bilayer in SiC Power Devices 7
Hybrid Deep Learning Pipeline for Advanced Electrical Wafer Defect Maps Assessment 7
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 7
The "first and euRopEAn siC eighT Inches pilOt liNe": A project, called REACTION, that will boost key SiC Technologies upgrading (developments) in Europe, unleashing Applications in the Automotive Power Electronics Sector 7
Structural characterization of semiconductor multi-layer pad 7
Thermal measurement and numerical analysis for automotive power modules 7
Intelligent Deep Motion Magnification Analysis in Advanced Driving Assistance Systems 7
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 7
Electrical characterization of gate oxide current in a silicon power MOS subjected to uniaxial mechanical stress 7
Identification of Interface States responsible for VTHHysteresis in packaged SiC MOSFETs 7
Thermal analysis approach for predicting power device lifetime 7
Mechanical characterization and modeling of different pad structures 7
Intelligent Optical Microscopy Defects Assessment of Silicon-Carbide Power Modules embedded in Next Generation Electric Cars 7
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 6
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules 6
TIMs for transfer molded power modules: Characterization, reliability, and modeling 6
Power Packages Interconnections for High Reliability Automotive Applications 6
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 6
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 6
Thermal transient testing alternatives for the characterisation of GaN HEMT power devices 6
Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field 6
Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications 6
Power losses comparison between Silicon Carbide and Silicon devices for an isolated DC-DC converter 5
NURBS-Based Surrogate Model for Fast and High-Fidelity Predictions of Pressure Drop and Pin-Fins Temperature in Traction Inverter 5
Dynamic Gate Stress: Impact of duty cycle and gate resistance on automotive grade planar-gate 1200 V SiC MOSFET 5
Damping Properties Evaluation of Viscoelastic Lattice Structures 5
Electrical Wafer Sorting: a Deep Learning Approach for Advanced Wafer Defect Map Evaluation 4
Totale 1.502
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Categoria #
all - tutte 5.165
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 5.165
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2023/20249 0 0 0 0 0 0 0 0 0 0 0 9
2024/202532 1 0 2 2 7 1 1 9 5 1 1 2
2025/20261.224 6 4 4 8 50 91 177 313 178 244 127 22
2026/2027245 51 194 0 0 0 0 0 0 0 0 0 0
Totale 1.510